Products

Coldium Premium Thermal Grease

Thermal paste developed with state-of-the-art technology and production standards. The Coldium thermal paste is made of raw materials processed with advanced technology, ensuring excellent performance and high thermal conductivity.

Advantages

Excellent performance: scientific ratio and stirring process that maximize thermal conductivity
High quality: use of imported raw materials
Very delicate: after repeated grinding, the thermal paste is more delicate. It can perfectly fit with heat dissipation components to maximize thermal conductivity
Very stable performance: eight-year useful life
Good insulation properties
Low thermal resistance, low oil separation, low volatility and no corrosion
Developed for overclocking

Specifications

Thermal Paste Legend

Thermal Conductivity: 15.3W/m-k
Color: Light Grey
Viscosity: 2360 Cps
Density: 2.85 g/cc
Specific Gravity: 2.7g/cm3
Volume Resistivity: 1.0×10 ¹³ Ω-cm
Thermal impedance @ 40psi / 0.08mm: ＜0.015 °C‐in2/W
Net Weight: 2g, 4g, 8g, 20g

Thermal Paste Edge

Thermal Conductivity: 17.8W/m-k
Color: Light Grey
Viscosity: 2320 Cps
Density: 2.97 g/cc
Dielectric Strength + 5.0 KV/mm
Volume Resistivity: 1.0×10 ¹³ Ω-cm
Thermal impedance @ 40psi / 0.08mm: ＜0.005 °C‐in2/W
Net Weight: 2g, 4g, 8g, 20g

Coldium Premium Thermal Pad

Based on advanced technology, Coldium pads exhibit outstanding, reliable physical and chemical thermal conduction performance and lower compression set. Its intrinsic adhesion and soft polymer structures ensure bridging the irregular gap. Voids to optimize heat dissipation without sacrificing thermal performance by laminating with additional adhesives or other surface treatments.

Highlights

Eco-friendly
Easy application
Non-electrically conductive
Soft and flexible
Non-toxic
Non-corrosive

Features and benefits

Superior thermal conductivity
High insulation compatibility
Low outgassing and durable aging performance
High inflation and flexibility
Good workability and ultra-thin offering
Wide range of thickness options
Cost-saving solutions

Typical applications

Laser equipment
High-power density LED module
Power supplies, UPS
Telecommunication equipment, 5G module units
Military gadgets, radar, power inverters
Signal transmitter, PC peripherals

Coldium Thermal Pad Origins

Thermal conductivity: 15.4W/m-k
Hardness: 45 – 55 Shore 00
Density: 3.4 g/cc
Thermal impedance @ 10psi /1mm: 0.124 / °C-in2-W
Volume resistivity: 1.8×10¹⁵ Ω-cm
Color: gray
Sizes: different sizes

Coldium Solutions LLC, USA
In compliance with EU RoHS Directive 2011/65/EU & REACH
Company – All rights reserved

Coldium Thermal Pad Skade

Thermal conductivity: 17W/m-k
Hardness: 45 – 55 Shore 00
Density: 3.5 g/cc
Thermal impedance @ 10psi /1mm: 0.121 / °C-in2-W
Volume resistivity: 1.8×10¹⁵ Ω-cm
Color: dark gray
Sizes: different sizes

Coldium Thermal Pad SKADE Adhesive ++

Thermal Pad Adhesive M3 Plus for heatsinks or chipsets that don't have a heatsink to apply pressure. Ideal for chipsets facing downward or tilted.

Coldium Liquid Metal M-273 - ULTRA HIGH THERMAL CONDUCTIVITY

Coldium Solutions M-273 liquid metal, specifically designed for products requiring extremely high thermal conductivity at room temperature.

SPECIAL METAL MIX

Coldium M-273 liquid metal is composed of special eutectic alloy components, gallium and indium and other metals, with excellent thermal conductivity and long-term stability.

HIGH TEMPERATURE RESISTANCE
Coldium M-273 liquid metal operates stably at temperatures ranging from -100°C to 1400°C, providing optimal and reliable heat dissipation performance from hot summers to intense cold.

DESIGN
Specially designed for products requiring extremely high thermal conductivity, such as chips or processors in computers, between heatsinks. Coldium M-273 liquid metal can even fill extremely small, irregular gaps between contact surfaces, which is unmatched by other ordinary thermal pastes.