News
April 15th, 2025: New Release! Introducing the ThermoLink™ GEL-PRO90
At COLDIUM, we continue to innovate by offering high-performance solutions in electronic cooling. That’s why we are proud to announce the launch of the new ThermoLink™ GEL-PRO90, a next-generation Liquid Thermal Pad.
Its main function is to allow the application of a thermal pad in GEL form, making the process simple, uniform, and precise, even in the smallest or most irregular spaces. Thanks to its consistency, it is very easy to spread and adapt to different thickness requirements.
ThermoLink™ GEL-PRO90 is ideal for CPUs, GPUs, and chipsets, as well as for RAM modules, M.2 solid-state drives, VRAM on graphics cards, and gaming consoles such as PS3, PS4, PS5, Xbox, among other electronic devices.
It features an exceptional thermal conductivity of 16.2 W/m·K, providing maximum efficiency in heat transfer and superior protection for your equipment.
Discover the future of electronic cooling with ThermoLink™ GEL-PRO90!
March 20th, 2025: Exciting News: Coldium Expands with New Office in Hong Kong
We are proud to share that Coldium is rapidly growing and reaching new heights! Thanks to the support of our partners, clients, and global distributors, Coldium has officially opened a new international office in Hong Kong, strengthening our position in the global thermal management industry.
March 15th, 2025: Coming Soon - Coldium ThermoLink™ GEL-PRO90. Get ready to experience the future of thermal interface materials.
October 13th, 2024: The time is over. New Thermal Pad Skade Adhesive Plus is now available!!
October 10th, 2024: We are proud to announce the launch of the new Coldium EDGE thermal paste. Available on ecommerce platforms and authorized distributors worldwide!!
Jun 16th, 2024: Skade thermal pad is renewed with a new skade model: adhesive plus+
April 16th, 2024: We are excited to announce the arrival of a new Coldium product. Stay tuned!
