Thermal paste developed with state-of-the-art technology and production standards. The Coldium thermal paste is made of raw materials processed with advanced technology, ensuring excellent performance and high thermal conductivity.
Advantages
Excellent performance: scientific ratio and stirring process that maximize thermal conductivity
High quality: use of imported raw materials
Very delicate: after repeated grinding, the thermal paste is more delicate. It can perfectly fit with heat dissipation components to maximize thermal conductivity
Very stable performance: eight-year useful life
Good insulation properties
Low thermal resistance, low oil separation, low volatility and no corrosion
Developed for overclocking
Coldium Premium Thermal Pad
Based on advanced technology, Coldium pads exhibit outstanding, reliable physical and chemical thermal conduction performance and lower compression set. Its intrinsic adhesion and soft polymer structures ensure bridging the irregular gap. Voids to optimize heat dissipation without sacrificing thermal performance by laminating with additional adhesives or other surface treatments.
Highlights
Eco-friendly Easy application Non-electrically conductive Soft and flexible Non-toxic Non-corrosive
Features and benefits
Superior thermal conductivity High insulation compatibility Low outgassing and durable aging performance High inflation and flexibility Good workability and ultra-thin offering Wide range of thickness options Cost-saving solutions
Typical applications
Laser equipment High-power density LED module Power supplies, UPS Telecommunication equipment, 5G module units Military gadgets, radar, power inverters Signal transmitter, PC peripherals